When it comes to NFC applications, everyone will first think of swiping mobile phones on public transportation terminals or on POS in convenience stores. In fact, the applications of the combination of NFC and SE are far more than these. This technology can be applied to mobile phone shield, tax control, cloud security, eUICCC, anti-counterfeiting and other solutions which were shared by CEC Huada Electronic Design Co., Ltd. (hereinafter referred to as "Huada Electronic Design") in the 2016 NFC / Mobile Payment Technology and Retail Application Summit.

Huada Electronic Design is a well-known smart card and security chip design company, and has worked in the field of mobile financial for many years. Now Huada Electronic Design has launched a second generation of embedded security chips to support the development in mobile financial applications. The product uses a leading 55nm technology, and an advanced security technology is introduced in the chip design. This security chip has been awarded the EAL4 + certificate and passed the UnionPay chip card integrated circuit security testing and level two commercial cryptography "Security Chip Cryptography Testing Criteria". This chip features high speed and low energy, and is compatible with the mainstream NFC Controller and easy for customers to integrate into the phone or terminals. At the same time, combined with years of industry advantages of Huada Electronic Design, this chip can support a variety of industrial applications, such as public transport, finance, mobile phone shield, third-party payments, health sector, anti-counterfeiting, tax control, CA, eUICC and cloud security. In order to help customers reduce time-to-market, Huada Electronic Design offers system-level solutions, including security chips, Java platforms, industrial applications, mobile clients and TSM.

Li Dan, the Senior Marketing Manager of Huada Electronic Design is delivering a speech at the forum

Huada Electronic Design pays great attention to promoting the coordinated development of the industry and is committed to building the ecosphere of mobile finance while adhering to the investment in product development. In view of the outstanding contribution to the industrial promotion, recently the company along with the Industrial and Commercial Bank, ZCCP, and Huawei were elected as the first session of vice chairmen units of the Beijing Mobile Financial Industry Alliance. With the help of both product innovation and industrial promotion, Huada Electronic Design will spare no effort to unite personages of all circles to facilitate the independence and controllability, and prosperity and development of the mobile financial industry.